3D AOI systems

At Midea Electronics, we deploy Kohyoung 3D AOI systems - the global SPI/AOI leader since 2013. Trusted by 3,800+ clients worldwide with 24,000+ installations and 700+ patents, our technology delivers uncompromising precision for SMT assembly verification.

Core Capabilities

✅ True 3D Inspection

Moiré fringe lighting eliminates shadows

Superior to traditional 2D RGB methods

✅ Full Defect Coverage

Detects:

• Component shift/reversal/polarity

• Wrong/missing/flipped components

• Tombstoning, bridging, voids

✅ Operator Efficiency

Single technician manages multiple machines

Reduces fatigue and re-inspection time

⚙️ Technical Advantages

► Cost Optimization

Centralized program/database management cuts setup time

► Micro-Precision

1μm resolution

Handles 0201 micro-components

► Zero-Error Operation

Mechanical stoppers eliminate PCB positioning drift

► High-Density Ready

Processes complex PCBs with dense pin counts

► Smart Traceability

SPI + Pre/Post AOI monitoring with triple-point alignment

Key Specifications

Board Compatibility:

◾ Size: 55×55mm → 510×510mm

◾ Thickness: 0.8mm → 5mm

◾ Component Clearance: 50mm (top) / 25mm (bottom)

Innovation Highlights:

◾ CAD/Gerber-based auto-alignment (no manual positioning)

◾ 3D visual debugging (eliminates 2D guesswork)

◾ One-click calibration (vs. RGB manual tuning)

◾ Multi-layer component visualization

◾ Full-board archival imaging

◾ Triple-point traceability system

Why Industry Leaders Choose Our AOI:

"Precision isn't an option – it's the price of entry in advanced electronics manufacturing."

Upgrade your quality control with inspection technology trusted by medical, automotive, and aerospace manufacturers worldwide.